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US09465732B2 Binning of blocks for dynamic linking 有权
动态链接的块分组

Binning of blocks for dynamic linking
Abstract:
A multi-plane non-volatile memory die includes circuits that receive and apply different parameters to different planes while accessing planes in parallel so that different erase blocks are accessed using individualized parameters. Programming parameters, and read parameters can be modified on a block-by-block basis with modification based on the number of write-erase cycles or other factors.
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