Invention Grant
- Patent Title: Configurable interconnection system
- Patent Title (中): 可配置互连系统
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Application No.: US12976735Application Date: 2010-12-22
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Publication No.: US09465756B2Publication Date: 2016-10-11
- Inventor: Jon C. R. Bennett
- Applicant: Jon C. R. Bennett
- Applicant Address: US CA Santa Clara
- Assignee: VIOLIN MEMORY INC.
- Current Assignee: VIOLIN MEMORY INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Brinks Gilson & Lione
- Main IPC: G06F13/00
- IPC: G06F13/00 ; G06F13/14 ; G06F13/36 ; G06F13/16 ; G11C19/00 ; H03K19/17

Abstract:
An interconnection system, apparatus and method is described where the motherboard may be populated with less than all of the modules that it has been designed to accept while maintaining a configuration such that in the event of a module failure, a memory controller failure, or a combination thereof, the connectivity of the remaining modules is maintained. Where data is stored using a RAID organization of the memory on the modules, the data may be reconstructed to a spare module. The system also provides for the orderly incremental expansion of the memory by adding additional memory modules and memory controllers, while maintaining the connectivity properties.
Public/Granted literature
- US20110213908A1 CONFIGURABLE INTERCONNECTION SYSTEM Public/Granted day:2011-09-01
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