Invention Grant
US09466544B2 Semiconducitive catechol group encapsulant adhesion promoter for a packaged electronic device
有权
用于封装电子器件的半促性儿茶酚类包封剂粘合促进剂
- Patent Title: Semiconducitive catechol group encapsulant adhesion promoter for a packaged electronic device
- Patent Title (中): 用于封装电子器件的半促性儿茶酚类包封剂粘合促进剂
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Application No.: US13754086Application Date: 2013-01-30
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Publication No.: US09466544B2Publication Date: 2016-10-11
- Inventor: Trent S. Uehling
- Applicant: Trent S. Uehling
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/28 ; H01L23/29 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/56
Abstract:
A packaged electronic device includes a package substrate, an electronic component die mounted to the package substrate, and an encapsulant bonded to a portion of the package substrate at a catechol group adhesion promoted interface that includes benzene rings bonded with the package substrate and the encapsulant.
Public/Granted literature
- US20140210063A1 SEMICONDUCITIVE CATECHOL GROUP ENCAPSULANT ADHESION PROMOTER FOR A PACKAGED ELECTRONIC DEVICE Public/Granted day:2014-07-31
Information query
IPC分类:
