Embodiments of the present invention provide a chip package structure and a chip packaging method, which is related to the field of electronic technologies, and can protect chips and effectively dissipate heat for chips. The chip package structure includes a substrate, chips, and a heat dissipating lid, where the chips include at least one master chip disposed on the substrate and at least one slave chip disposed on the substrate; the heat dissipating lid is bonded to the slave chip by using a heat conducting material, and the heat dissipating lid covers the at least one slave chip; and the heat dissipating lid includes a heat dissipating window at a position corresponding to the at least one master chip. The embodiments of the present invention are applicable to multi-chip packaging.