Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14274861Application Date: 2014-05-12
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Publication No.: US09466601B2Publication Date: 2016-10-11
- Inventor: Junggil Yang , Sangsu Kim , TaeYong Kwon , Sung Gi Hur
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0095490 20130812
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238

Abstract:
A semiconductor device includes a substrate including first and second regions, a first transistor provided on the first region to include a first channel region protruding from the substrate, and a second transistor provided on the second region to include a second channel region and a gate electrode extending between the substrate and the second channel region. The first channel region may include a lower semiconductor pattern containing a different material from the second channel region and an upper semiconductor pattern containing the same material as the second channel region.
Public/Granted literature
- US20150041899A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-02-12
Information query
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