Invention Grant
- Patent Title: Ground grid for superconducting circuits
- Patent Title (中): 超导电路接地网
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Application No.: US14482654Application Date: 2014-09-10
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Publication No.: US09466643B2Publication Date: 2016-10-11
- Inventor: Quentin P. Herr , Anna Y. Herr , Steven Brian Shauck , Eileen Jiwon Min
- Applicant: Quentin P. Herr , Anna Y. Herr , Steven Brian Shauck , Eileen Jiwon Min
- Applicant Address: US VA Falls Church
- Assignee: Northrop Grumman Systems Corporation
- Current Assignee: Northrop Grumman Systems Corporation
- Current Assignee Address: US VA Falls Church
- Agency: Tarolli, Sundheim, Covell & Tummino LLP
- Main IPC: G11C11/44
- IPC: G11C11/44 ; H01L27/18 ; H01L39/02 ; H01L39/22 ; H01L39/24 ; H03K19/195 ; G11C19/32

Abstract:
One example includes a superconducting circuit. The circuit includes a plurality of layers comprising a first conductor layer and a second conductor layer overlying the first conductor layer, each of the first and second conductor layers comprising at least one signal element. The circuit also includes a ground grid that is conductively coupled to ground and comprises a first plurality of parallel ground lines that occupy the first conductor layer and extend in a first direction and a second plurality of parallel ground lines that occupy the second conductor layer and extend in a second direction that is orthogonal with respect to the first direction.
Public/Granted literature
- US20160071903A1 GROUND GRID FOR SUPERCONDUCTING CIRCUITS Public/Granted day:2016-03-10
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