Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14156892Application Date: 2014-01-16
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Publication No.: US09466725B2Publication Date: 2016-10-11
- Inventor: Akihisa Shimomura
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2013-010829 20130124
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/786 ; H01L29/51 ; H01L29/49 ; H01L29/66

Abstract:
A miniaturized transistor having high electrical characteristics can be provided with high yield. High performance, high reliability, and high productivity of a semiconductor device including the transistor can be achieved. The semiconductor device includes a gate electrode over an insulating surface; a base insulating film which is over the insulating surface and from which the gate electrode protrudes; a gate insulating film over the base insulating film and the gate electrode; an oxide semiconductor film over the gate insulating film; and a source electrode and a drain electrode in contact with an oxide semiconductor film. The thickness of the oxide semiconductor film is smaller than the difference between the thickness of the gate electrode and the thickness of the base insulating film.
Public/Granted literature
- US20140203277A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-07-24
Information query
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