Method of manufacturing at least one card each including an electronic module (2), this method providing a frame (14) or a plate (18) having at least one aperture (16) provided for receiving said electronic module. It is characterized in that at least one part of the peripheral area of said at least one aperture is deformed or crushed by localized application of pressure to said at least one part of the peripheral area on the frame or plate, so as to reduce locally the thickness of the frame or plate in said at least one part of the peripheral area, in that the electronic module is brought opposite the corresponding aperture so that at least one zone of the electronic module is superposed on said at least one part of the peripheral area, and in that a material connection is established between said at least one part of the peripheral area and said at least one corresponding zone of the electronic module for assembling said electronic module to the frame or plate before a resin is added at least on one side of the electronic module in a subsequent step of the method.