Integrated circuits and methods of producing the same are provided. In an exemplary embodiment, an integrated circuit includes a substrate, where the substrate includes a buried oxide (BOX) layer positioned between a handle layer and a semiconductor layer. An electronic component overlies the buried oxide layer on a semiconductor layer side, and a gate line is electrically connected to the electronic component. A body line is also electrically connected to the electronic component. A first through BOX contact electrically connects the gate line with the handle layer, and a second through BOX contact electrically connects the body line with the handle layer.