A method of manufacturing a semiconductor light emitting device package includes arranging a plurality of light emitting structures on a support substrate, each light emitting structure including a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, bonding a light transmissive substrate to the plurality of light emitting structures, the light transmissive substrate having a plurality of wavelength conversion regions corresponding to the plurality of light emitting structures, respectively, removing the support substrate from the plurality of light emitting structures, and separating individual semiconductor light emitting device packages from one another by removing at least a portion of the light transmissive substrate.