Invention Grant
- Patent Title: Shield connector structure
- Patent Title (中): 屏蔽连接器结构
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Application No.: US14167142Application Date: 2014-01-29
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Publication No.: US09472901B2Publication Date: 2016-10-18
- Inventor: Feng Wang
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2013-030749 20130220
- Main IPC: H01R9/03
- IPC: H01R9/03 ; H01R13/648 ; H01R13/6593 ; H01R13/6596 ; H01R9/05 ; H01R13/52 ; H01R13/74 ; H01R101/00

Abstract:
A shield connector includes: a housing fixed to an outer surface of the metallic case; a shield member connecting a shield portion of a shield wire to the metallic case: a shield pipe as a pressure-bonding-member for swaging and connecting the shield portion and the shield member. The shield pipe includes: a tubular portion through which the shield wire and the shield member are inserted; a flange portion extended radially from the other side edge of the tubular portion; and a swage portion where the tubular portion is deformed to press the shield portion and the shield member 12.
Public/Granted literature
- US20140235104A1 SHIELD CONNECTOR STRUCTURE Public/Granted day:2014-08-21
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