Invention Grant
- Patent Title: Busbar coupling device assembly
- Patent Title (中): 母线联轴器装置
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Application No.: US14550758Application Date: 2014-11-21
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Publication No.: US09472938B2Publication Date: 2016-10-18
- Inventor: Hyun Si Hwang , Sung Jun Oh , Ki Young Moon
- Applicant: LSIS CO., LTD.
- Applicant Address: KR Anyang-si
- Assignee: LSIS CO., LTD.
- Current Assignee: LSIS CO., LTD.
- Current Assignee Address: KR Anyang-si
- Agency: Lee, Hong, Degerman, Kang & Waimey
- Agent Jonathan Kang; Richard Salfelder
- Priority: KR20-2013-0009986U 20131203
- Main IPC: H01R3/00
- IPC: H01R3/00 ; H02G5/02 ; H05K7/14

Abstract:
Provided is a busbar coupling device. The busbar coupling device includes: a plate including a first side and a second side disposed opposite to each other; a first end wall part protruding and extending in a direction that the first side faces at a first end part in a length direction of the plate; a first protrusion part disposed at the plate, spaced from the first end wall part, and protruding in the direction that the first side faces; a second end wall part protruding and extending from a second end part disposed opposite to the first end part to a direction that the second side faces in the length direction of the plate; and a second protrusion part disposed at the plate, spaced from the first end wall part, and protruding in the direction that the first side faces.
Public/Granted literature
- US20150155692A1 BUSBAR COUPLING DEVICE ASSEMBLY Public/Granted day:2015-06-04
Information query