A surface acoustic wave filter includes a piezoelectric substrate, a lower-layer wiring line, an upper-layer wiring line, and an interlayer insulating film. The lower-layer wiring line is disposed on the piezoelectric substrate. The upper-layer wiring line crosses the lower-layer wiring line. The upper-layer wiring line has a potential that is different from the potential of the lower-layer wiring line. The interlayer insulating film is disposed between the lower-layer wiring line and the upper-layer wiring line. The interlayer insulating film has a portion that has a width that is not greater than the width of the upper-layer wiring line in a cross-sectional view taken along a direction in which the lower-layer wiring line extends.