Invention Grant
- Patent Title: Stacked circuit board assembly with compliant middle member
- Patent Title (中): 堆叠电路板组件，带有中间构件
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Application No.: US14038352Application Date: 2013-09-26
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Publication No.: US09474148B2Publication Date: 2016-10-18
- Inventor: James Liberty , John W. Ramonas , Dennis A. Maller
- Applicant: Trumpet Holdings, Inc.
- Applicant Address: US WI Milwaukee
- Assignee: Trumpet Holdings, Inc.
- Current Assignee: Trumpet Holdings, Inc.
- Current Assignee Address: US WI Milwaukee
- Agency: Ryan Kromholz & Manion, S.C.
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/14
Abstract:
A compliant middle member to be used between encapsulated stacked circuit boards contained in an enclosure. The compliant middle member absorbing expansion forces from an encapsulant experiencing thermal expansion, thereby diverting and reducing the expansion forces exerted upon the electrical components.
Public/Granted literature
- US20150085453A1 STACKED CIRCUIT BOARD ASSEMBLY WITH COMPLIANT MIDDLE MEMBER Public/Granted day:2015-03-26
Information query
