Invention Grant
- Patent Title: Housing for electronic equipment and manufacturing method thereof
- Patent Title (中): 电子设备外壳及其制造方法
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Application No.: US13893646Application Date: 2013-05-14
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Publication No.: US09474192B2Publication Date: 2016-10-18
- Inventor: Koichi Kimura , Masanobu Ishiduka
- Applicant: Fujitsu Limited
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H05K13/00
- IPC: H05K13/00 ; B32B7/12 ; B32B15/08 ; B32B27/36 ; H05K5/02 ; B32B27/30

Abstract:
A method for manufacturing a housing for an electronic equipment containing metal housing configured to house an electronic equipment therein and a resin film with which the metal housing is coated includes the steps of heating a resin film so as to soften the resin film, coating a metal housing with the heated resin film, and adhering the coated resin film to the metal housing. The preferred housing is one in which an adhesive layer, a print layer, or both thereof is disposed between a resin layer contained in the resin film and the metal housing, and in which the resin film contains at least one thermoplastic resin selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and polylactic acid (PLA).
Public/Granted literature
- US20130248105A1 HOUSING FOR ELECTRONIC EQUIPMENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-09-26
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