Invention Grant
- Patent Title: Method of manufacturing semiconductor element
- Patent Title (中): 制造半导体元件的方法
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Application No.: US14641202Application Date: 2015-03-06
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Publication No.: US09478418B2Publication Date: 2016-10-25
- Inventor: Atsushi Era , Akihito Ohno , Takahiro Yamamoto
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2014-110127 20140528
- Main IPC: H01L21/338
- IPC: H01L21/338 ; H01L21/02 ; H01L29/66 ; H01L29/778 ; H01L29/207

Abstract:
A method of manufacturing a semiconductor element includes a first step of epitaxially growing an AlN layer on a substrate, a second step of forming a buffer layer on the AlN layer by epitaxially growing AlxGayInzN where x, y, and z satisfy x+y+z=1 and y is not zero without adding Fe, a third step of forming a resistance layer on the buffer layer by epitaxially growing AlxGayInzN where x, y, and z satisfy x+y+z=1 and y is not zero while adding Fe, a step of epitaxially growing a channel layer on the resistance layer, a step of epitaxially growing an electron supply layer above the channel layer, and a step of forming an electrode above the electron supply layer.
Public/Granted literature
- US20150348780A1 METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT Public/Granted day:2015-12-03
Information query
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