Invention Grant
- Patent Title: Substrate support with wire mesh plasma containment
- Patent Title (中): 衬底支撑与丝网等离子体容纳
-
Application No.: US13684672Application Date: 2012-11-26
-
Publication No.: US09478447B2Publication Date: 2016-10-25
- Inventor: Olkan Cuvalci , Gwo-Chuan Tzu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H05B3/06
- IPC: H05B3/06 ; H01L21/67 ; H05B3/28

Abstract:
Embodiments of substrate supports having a wire mesh plasma containment are provided herein. In some embodiments, a substrate support may include a plate comprising a first surface, an opposing second surface, a thickness bounded by the first and second surfaces, and a first perimetrical surface; a first heater element disposed between the first and second surfaces; a wire mesh disposed between the first and second surfaces; a ground connector mounted to a surface of the plate; at least one electrical connection between the wire mesh and the ground connector; and an elongate shaft comprising a first end and an opposite second end, wherein the plate second surface is mounted to the first end of the shaft.
Public/Granted literature
- US20140144901A1 SUBSTRATE SUPPORT WITH WIRE MESH PLASMA CONTAINMENT Public/Granted day:2014-05-29
Information query