Invention Grant
- Patent Title: Dual metal contact scheme for CMOS devices
- Patent Title (中): CMOS器件的双金属接触方案
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Application No.: US14795524Application Date: 2015-07-09
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Publication No.: US09478468B1Publication Date: 2016-10-25
- Inventor: Kangguo Cheng , Ali Khakifirooz , Alexander Reznicek , Tenko Yamashita
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L21/8238 ; H01L27/092

Abstract:
A semiconductor structure includes non-metal semiconductor alloy containing contact structures for an n-type field effect transistor (nFET) and a metal semiconductor alloy containing contact structures for a p-type field effect transistor (pFET). Notably, each non-metal semiconductor alloy containing contact structure includes a titanium liner that directly contacts a topmost surface of a source/drain region of the nFET, while each metal semiconductor alloy containing contact structure includes a Ni—Pt semiconductor alloy contact that directly contacts a surface of a source/drain region of the pFET.
Information query
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