Invention Grant
- Patent Title: Substrate processing and alignment
- Patent Title (中): 基板加工和对准
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Application No.: US11715525Application Date: 2007-03-07
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Publication No.: US09478501B2Publication Date: 2016-10-25
- Inventor: Erich Thallner
- Applicant: Erich Thallner
- Agent William C. Milks, III
- Main IPC: H01L23/544
- IPC: H01L23/544 ; B82Y10/00 ; B82Y40/00 ; G03F7/00 ; G03F9/00

Abstract:
A substrate can efficiently be manufactured by separating the alignment and the actual processing when an alignment mark is provided, which is fixed with respect to the substrate and when position information on a position of a process area on the substrate is retrieved with respect to the alignment mark before the substrate is processed. During the processing alignment can then be performed by redetermining the position of the alignment mark only once and by using the stored position information on the position of the process area.
Public/Granted literature
- US20070210460A1 Substrate processing and alignment Public/Granted day:2007-09-13
Information query
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