Invention Grant
- Patent Title: Method and apparatus of forming ESD protection device
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Application No.: US14058390Application Date: 2013-10-21
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Publication No.: US09478633B2Publication Date: 2016-10-25
- Inventor: Ming Zhu , Lee-Wee Teo , Harry Hak-Lay Chuang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8234 ; H01L23/60 ; H01L29/78

Abstract:
The present disclosure provides a semiconductor device having a transistor. The transistor includes a source region, a drain region, and a channel region that are formed in a semiconductor substrate. The channel region is disposed between the source and drain regions. The transistor includes a first gate that is disposed over the channel region. The transistor includes a plurality of second gates that are disposed over the drain region.
Public/Granted literature
- US20140038376A1 Method and Apparatus of Forming ESD Protection Device Public/Granted day:2014-02-06
Information query
IPC分类: