Invention Grant
- Patent Title: Method of manufacturing a circuit board by punching
- Patent Title (中): 通过冲压制造电路板的方法
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Application No.: US13896853Application Date: 2013-05-17
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Publication No.: US09478674B2Publication Date: 2016-10-25
- Inventor: Koichi Kumai , Ryuji Ueda , Kentaro Kubota , Shigeki Kudo , Minoru Kawasaki
- Applicant: DSM IP ASSETS B.V.
- Applicant Address: NL Heerlen
- Assignee: DSM IP ASSETS B.V.
- Current Assignee: DSM IP ASSETS B.V.
- Current Assignee Address: NL Heerlen
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2010-259186 20101119; JP2011-069309 20110328; JP2011-126519 20110606
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H01L31/02 ; H05K3/20 ; H05K1/02 ; H01L31/05
Abstract:
A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.
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