Invention Grant
US09478791B2 Method for forming pattern, structural body, method for producing comb-shaped electrode, and secondary cell
有权
形成图案,结构体,梳状电极的制造方法和二次电池的方法
- Patent Title: Method for forming pattern, structural body, method for producing comb-shaped electrode, and secondary cell
- Patent Title (中): 形成图案,结构体,梳状电极的制造方法和二次电池的方法
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Application No.: US14426300Application Date: 2013-08-28
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Publication No.: US09478791B2Publication Date: 2016-10-25
- Inventor: Kaoru Ishikawa , Takahiro Asai
- Applicant: Tokyo Ohka Kogyo Co., Ltd.
- Applicant Address: JP Kawasaki-Shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2012-197802 20120907; JP2013-026856 20130214
- International Application: PCT/JP2013/073058 WO 20130828
- International Announcement: WO2014/038454 WO 20140313
- Main IPC: G03F7/00
- IPC: G03F7/00 ; H01M6/40 ; H01M4/04 ; H01M4/13 ; H01M4/70 ; H01M4/139 ; H01M10/058 ; G03F7/40 ; H01L21/288 ; H01M10/052 ; H01M10/0565 ; H01M4/02 ; H01L21/768 ; G03F7/12

Abstract:
A method for forming a pattern multiple patterns of identical or different pattern materials can be formed on a support in a short time, a structural body, a method for producing a comb-shaped electrode, and a secondary cell. The pattern forming method, in which n patterns (n≧2) are formed on a support, includes forming a first resist layer on the support surface; repeating: forming a guide hole through all resist layers by exposure and development, filling a kth pattern material into the guide hole by a screen printing process, and forming a (k+1)th resist layer on the kth resist layer and the pattern materials, regarding kth (k=1 to n−1) pattern material and resist layer in order of k=1 to n−1; performing guide hole formation and nth pattern material filling similarly, and removing all of the resist layers.
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