Invention Grant
- Patent Title: Wiring board
- Patent Title (中): 接线板
-
Application No.: US14061926Application Date: 2013-10-24
-
Publication No.: US09478839B2Publication Date: 2016-10-25
- Inventor: Kohei Matsumaru
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-073735 20120328
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01P3/02 ; H05K1/02

Abstract:
Provided is a wiring board including: a board; a differential transmission line constituted by two wirings disposed on the board in parallel; an insulation resin layer which is formed on part of a face of the board. A stepped portion constituted by a lateral face of the insulation resin layer is formed at a boundary between the face of the board and a top face of the insulation resin layer. The two wirings extend from the face of the board to the top face of the insulation resin layer so as to traverse the stepped portion. The extending direction of the wirings traversing the stepped portion and the direction of a periphery are perpendicular to each other in a plan view of the board, the periphery being defined by a boundary between the top face of the insulation resin layer and the lateral face of the insulation resin layer.
Public/Granted literature
- US20140049344A1 WIRING BOARD Public/Granted day:2014-02-20
Information query