Invention Grant
- Patent Title: Wiring substrate and manufacturing method thereof
- Patent Title (中): 接线基板及其制造方法
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Application No.: US14289401Application Date: 2014-05-28
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Publication No.: US09480142B2Publication Date: 2016-10-25
- Inventor: Akira Harao , Mototatsu Matsunaga , Yasuhiro Sugiura , Minoru Kubota
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-128185 20100603; JP2010-128186 20100603; JP2010-232538 20101015; JP2011-120793 20110530
- Main IPC: H01R9/00
- IPC: H01R9/00 ; H05K1/02 ; H01R12/72 ; H05K3/36 ; H05K1/11 ; H05K3/10 ; H01L23/498 ; H05K7/10 ; H05K1/05 ; H05K3/20 ; H05K3/34 ; H05K1/14
Abstract:
Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.
Public/Granted literature
- US20140262451A1 WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-09-18
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