Invention Grant
- Patent Title: Metal-clad laminate and printed wiring board
- Patent Title (中): 覆金属层压板和印刷线路板
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Application No.: US14000834Application Date: 2012-02-15
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Publication No.: US09480148B2Publication Date: 2016-10-25
- Inventor: Hiroharu Inoue , Shingo Yoshioka , Koji Kishino , Takatoshi Abe
- Applicant: Hiroharu Inoue , Shingo Yoshioka , Koji Kishino , Takatoshi Abe
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-034304 20110221
- International Application: PCT/JP2012/000981 WO 20120215
- International Announcement: WO2012/114680 WO 20120830
- Main IPC: H05K1/02
- IPC: H05K1/02 ; B32B15/08 ; H05K1/03 ; B32B15/14 ; H05K3/02

Abstract:
A metal-clad laminate of the present invention comprises an insulating layer, and a metal layer that is present at least on one surface side of the insulating layer. The insulating layer is a laminate of at least three layers: a center layer, a first resin layer that is present on one surface side of the center layer, and a second resin layer that is present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a respective resin composition. The elastic modulus of the cured product of the resin composition contained in the center layer is lower than the elastic moduli of both the cured product of the resin composition contained in the first resin layer and the cured product of the resin composition contained in the second resin layer.
Public/Granted literature
- US20130319735A1 METAL-CLAD LAMINATE AND PRINTED WIRING BOARD Public/Granted day:2013-12-05
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