Invention Grant
- Patent Title: Carrier tape for tab-package and manufacturing method thereof
- Patent Title (中): 用于片状包装的载带及其制造方法
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Application No.: US13188882Application Date: 2011-07-22
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Publication No.: US09480152B2Publication Date: 2016-10-25
- Inventor: Tae Ki Hong , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo
- Applicant: Tae Ki Hong , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2010-0096018 20101001
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/00 ; H05K1/02 ; H01L23/00 ; H01L23/498

Abstract:
The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.
Public/Granted literature
- US20120186862A1 CARRIER TAPE FOR TAB-PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-07-26
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