Invention Grant
- Patent Title: Housing for accommodating an electric circuit board
- Patent Title (中): 用于容纳电路板的外壳
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Application No.: US14389844Application Date: 2013-03-14
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Publication No.: US09480181B2Publication Date: 2016-10-25
- Inventor: Marc Lindkamp , Rainer Bussmann
- Applicant: Harting Electronics GmbH
- Applicant Address: DE Espelkamp
- Assignee: HARTING ELECTRONICS GMBH
- Current Assignee: HARTING ELECTRONICS GMBH
- Current Assignee Address: DE Espelkamp
- Agency: Jacobson Holman, PLLC.
- Priority: DE102012103359 20120418
- International Application: PCT/DE2013/100099 WO 20130314
- International Announcement: WO2013/156022 WO 20131024
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/14

Abstract:
In a housing 1 for receiving an electric circuit board 50 it is proposed to provide in a first housing half 2 of the housing 1 a plurality of bearing pads 20, 21 located at various levels. These bearing pads 20, 21 receive, together with counter bearing pads 30, 31 provided in a second housing half 30, the electric circuit board 50. A plurality of support points 55, 56 is provided on the electric circuit board 50, each of which support points 55, 56 is respectively associated with the bearing pads 20, 21 and counter bearing pads 30, 31. By removing individual support points 55, 56, the bearing pads 20, 21 and counter bearing pads 30, 31 are selected, on which the circuit board 50 is supposed to rest. By selecting the bearing pads 20, 21 and counter bearing pads 30, 31 lying at different levels, the level of the electric circuit board 50 in the housing 1 is determined.
Public/Granted literature
- US20150070859A1 HOUSING FOR ACCOMMODATING AN ELECTRIC CIRCUIT BOARD Public/Granted day:2015-03-12
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