Invention Grant
- Patent Title: Tire pressure sensor module
- Patent Title (中): 轮胎压力传感器模块
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Application No.: US14676820Application Date: 2015-04-02
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Publication No.: US09481216B2Publication Date: 2016-11-01
- Inventor: Tsaichiang Chow , Shihchin Cho , Shihyao Lin , Tzu-Wen Ko , Chi-Hung Chen
- Applicant: SYSGRATION LTD. , CUB Elecparts Inc.
- Applicant Address: TW Taipei
- Assignee: SYSGRATION LTD.
- Current Assignee: SYSGRATION LTD.
- Current Assignee Address: TW Taipei
- Agent Leong C. Lei
- Priority: TW103206033U 20140408
- Main IPC: B60C23/00
- IPC: B60C23/00 ; B60C23/04 ; B60C23/20

Abstract:
The tire pressure sensor module contains a casing, a nozzle, a sleeve element, a fastening element, and a two-way tire information transmission and sensory system inside the casing. The casing has a trough and an air opening. The nozzle contains a nozzle mouth and a nozzle base. The nozzle base is joined to the casing, and the mouth is threaded through the sleeve element. The nozzle and the sleeve element are secured to the casing by the fastening element through the trough. The two-way tire information transmission and sensory system contains a battery, a micro-controller circuit, a low-power-consumption Bluetooth wireless transceiver circuit, a boosting/regulating circuit, a pressure sensor, an operation amplifier, a gravity sensor, a temperature sensor, and an antenna.
Public/Granted literature
- US20150283868A1 TIRE PRESSURE SENSOR MODULE Public/Granted day:2015-10-08
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