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US09481565B2 Encapsulated component comprising a MEMS component and method for the production thereof 有权
包含MEMS组件的封装组件及其制造方法

  • Patent Title: Encapsulated component comprising a MEMS component and method for the production thereof
  • Patent Title (中): 包含MEMS组件的封装组件及其制造方法
  • Application No.: US14759602
    Application Date: 2013-10-23
  • Publication No.: US09481565B2
    Publication Date: 2016-11-01
  • Inventor: Wolfgang Pahl
  • Applicant: Epcos AG
  • Applicant Address: DE München
  • Assignee: Epcos AG
  • Current Assignee: Epcos AG
  • Current Assignee Address: DE München
  • Agency: Nixon Peabody LLP
  • Priority: DE102013100388 20130115
  • International Application: PCT/EP2013/072183 WO 20131023
  • International Announcement: WO2014/111178 WO 20140724
  • Main IPC: B81B7/00
  • IPC: B81B7/00 ;  B81C1/00 ;  H04R23/00 ;  B81C3/00
Encapsulated component comprising a MEMS component and method for the production thereof
Abstract:
A component comprising a carrier, a chip component and a MEMS component is proposed, wherein the mechanically sensitive MEMS component is mounted below a half-shell on the carrier. The component is encapsulated with a molding compound in a transfer molding process.
Abstract(Chinese):

提出了包括载体，芯片部件和MEMS部件的部件，其中机械敏感的MEMS部件安装在载体上的半壳下方。 该组分在传递模塑过程中用模塑料封装。

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