Invention Grant
- Patent Title: Bonding material composition, aluminum nitride bonded body, and method for producing the same
- Patent Title (中): 粘合材料组合物,氮化铝粘结体及其制造方法
-
Application No.: US14561449Application Date: 2014-12-05
-
Publication No.: US09481813B2Publication Date: 2016-11-01
- Inventor: Masashi Goto , Noboru Nishimura , Yuji Katsuda
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2013-272947 20131227; JP2014-188416 20140917; JP2014-191258 20140919
- Main IPC: C04B37/00
- IPC: C04B37/00 ; C09J5/00 ; C09J1/00 ; C09J5/06

Abstract:
A first bonding material composition according to the present invention is a bonding material composition used when aluminum nitride sintered bodies containing a rare-earth metal oxide are bonded to each other, in which the bonding immaterial composition contains, in addition, to an O element-containing aluminum nitride raw material, (a) as a fluorine compound, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, or (b) as a fluorine compound, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, and a rare-earth metal oxide.
Public/Granted literature
- US20150184030A1 BONDING MATERIAL COMPOSITION, ALUMINUM NITRIDE BONDED BODY, AND METHOD FOR PRODUCING THE SAME Public/Granted day:2015-07-02
Information query