Invention Grant
- Patent Title: Hot melt adhesive
- Patent Title (中): 热熔胶
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Application No.: US14523275Application Date: 2014-10-24
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Publication No.: US09481815B2Publication Date: 2016-11-01
- Inventor: Makoto Takenaka
- Applicant: HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO. KGAA
- Current Assignee: HENKEL AG & CO. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Priority: JP2012-101888 20120426
- Main IPC: C09J167/04
- IPC: C09J167/04 ; C09J167/02
Abstract:
The present invention provides a hot melt adhesive being highly environmentally-friendly, and as well having sufficient tackiness, adhesion, thermal stability and the like. The present invention relates to a hot melt adhesive comprising (A) a polar functional group-modified conjugated diene-based polymer, (B) an aliphatic polyester-based resin, and (C) a tackifier resin.
Public/Granted literature
- US20150045488A1 HOT MELT ADHESIVE Public/Granted day:2015-02-12
Information query
IPC分类:
