Invention Grant
- Patent Title: Air valve for electronics enclosures
- Patent Title (中): 电子机柜用空气阀
-
Application No.: US14151097Application Date: 2014-01-09
-
Publication No.: US09482349B2Publication Date: 2016-11-01
- Inventor: William J. Anderl , Bret P. Elison , Phillip V. Mann , Arden L. Moore , Arvind K. Sinha
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Richard A. Wilhelm; Robert Wiliams
- Main IPC: H05K5/00
- IPC: H05K5/00 ; F16K3/10 ; F16K31/08 ; F16K3/02 ; F16K3/03 ; G06F1/20 ; H05K7/20

Abstract:
An air valve includes a frame and a sheet of thin material. The frame may have an outlet-side member configured mounted on a fan housing and an inlet-side member rotatably coupled to the outlet-side member. The material may have top and bottom edges, and a plurality of folds perpendicular to the top and bottom side edges that divide the sheet into a plurality of sections. The material may be attached to the outlet-side member and the inlet-side member, and configurable between folded and expanded positions. An attraction between a magnetic component on the inlet-side member and a magnetic component on a rotating fan blade may cause the inlet-side member to rotate, moving the material into the folded configuration. When the fan blade is not rotating, a spring attached at a pivot point may cause the inlet-side member to rotate in an opposite direction, moving the material into the expanded position.
Public/Granted literature
- US20150192219A1 AIR VALVE FOR ELECTRONICS ENCLOSURES Public/Granted day:2015-07-09
Information query