Invention Grant
- Patent Title: Linkage conduit for vacuum chamber applications
- Patent Title (中): 真空室应用连接管道
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Application No.: US14482761Application Date: 2014-09-10
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Publication No.: US09484183B2Publication Date: 2016-11-01
- Inventor: Eric D. Hermanson , Robert J. Mitchell , Steven Anella , Jeffrey Charles Blahnik , William T. Weaver , Michael Rohrer , James P. Buonodono
- Applicant: Varian Semiconductor Equipment Associates, Inc.
- Applicant Address: US MA Gloucester
- Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Gloucester
- Main IPC: H01J37/317
- IPC: H01J37/317 ; H01J37/20 ; H01J21/18

Abstract:
An ion implantation apparatus including an enclosure defining a process chamber, a carriage slidably mounted on a shaft within the process chamber and coupled to a drive mechanism adapted to selectively move the carriage along the shaft. A platen assembly can be coupled to the carriage, and a linkage conduit can extend between a side wall of the enclosure and the carriage. The linkage conduit can include a plurality of pivotably interconnected linkage members that define a contiguous internal volume that is sealed from the process chamber. The contiguous volume can be held at a desired vacuum pressure separate from the vacuum environment of the process chamber.
Public/Granted literature
- US20160071686A1 LINKAGE CONDUIT FOR VACUUM CHAMBER APPLICATIONS Public/Granted day:2016-03-10
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