Invention Grant
- Patent Title: Methods for controlling warpage in packaging
-
Application No.: US14725126Application Date: 2015-05-29
-
Publication No.: US09484226B2Publication Date: 2016-11-01
- Inventor: Chien Ling Hwang , Bor-Ping Jang , Hsin-Hung Liao , Yeong-Jyh Lin , Hsiao-Chung Liang , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/538 ; H01L21/78 ; H01L21/56 ; H01L21/683
Abstract:
A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.
Public/Granted literature
- US20150262845A1 Methods for Controlling Warpage in Packaging Public/Granted day:2015-09-17
Information query
IPC分类:
