Invention Grant
- Patent Title: Air gap contact formation for reducing parasitic capacitance
- Patent Title (中): 用于减小寄生电容的气隙接触形成
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Application No.: US14643011Application Date: 2015-03-10
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Publication No.: US09484250B2Publication Date: 2016-11-01
- Inventor: Effendi Leobandung
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/768 ; H01L29/66 ; H01L29/78 ; H01L29/423 ; H01L29/08 ; H01L23/535

Abstract:
A functional gate structure is located on a surface of a semiconductor material portion and including a U-shaped gate dielectric portion and a gate conductor portion. A source region is located on one side of the functional gate structure, and a drain region is located on another side of the functional gate structure. The source region and drain region both have a topmost surface that is above a topmost surface of the semiconductor material portion and another surface that touches a portion of the U-shaped gate dielectric. A contact structure is located on the topmost surface of the source region and/or the drain region. A middle-of-the-line air gap contact is located between the contact structure and the functional gate structure and above at least one of the source region and the drain region. The middle-of-the-line air gap contact is sealed by a portion of a conformal dielectric material.
Public/Granted literature
- US20160268158A1 AIR GAP CONTACT FORMATION FOR REDUCING PARASITIC CAPACITANCE Public/Granted day:2016-09-15
Information query
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