Invention Grant
US09484253B2 Signal line fabrication method, array substrate fabrication method, array substrate and display device
有权
信号线制造方法,阵列基板制造方法,阵列基板和显示装置
- Patent Title: Signal line fabrication method, array substrate fabrication method, array substrate and display device
- Patent Title (中): 信号线制造方法,阵列基板制造方法,阵列基板和显示装置
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Application No.: US14387519Application Date: 2013-05-20
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Publication No.: US09484253B2Publication Date: 2016-11-01
- Inventor: Changjiang Yan , Haizheng Xie , Lei Chen , Shaoying Xu , Zhenyu Xie
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201310056045 20130222
- International Application: PCT/CN2013/075909 WO 20130520
- International Announcement: WO2014/127589 WO 20140828
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L29/423 ; H01L29/49 ; H01L27/12

Abstract:
Embodiments of the disclosure provide a signal line fabrication method, an array substrate fabrication method, an array substrate and a display device. The signal line fabrication method includes: sequentially forming a material layer for forming the signal line, a material layer for forming a first barrier layer and a material layer for forming a second barrier layer; forming the first barrier layer and the second barrier layer by a patterning process; and forming the signal line by a patterning process.
Public/Granted literature
- US20150104937A1 SIGNAL LINE FABRICATION METHOD, ARRAY SUBSTRATE FABRICATION METHOD, ARRAY SUBSTRATE AND DISPLAY DEVICE Public/Granted day:2015-04-16
Information query
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