Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US14686828Application Date: 2015-04-15
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Publication No.: US09484271B2Publication Date: 2016-11-01
- Inventor: Katsuyuki Horita , Toshiaki Iwamatsu , Hideki Makiyama , Yoshiki Yamamoto
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-250493 20111116
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84 ; H01L29/78 ; H01L21/48 ; H01L27/02 ; H01L27/12 ; H01L21/768 ; H01L29/786 ; H01L21/74 ; H01L21/28 ; H01L21/283 ; H01L21/311 ; H01L29/66

Abstract:
Characteristics of a semiconductor device are improved. A semiconductor device of the present invention includes: (a) a MISFET arranged in an active region formed of a semiconductor region surrounded by an element isolation region; and (b) an insulating layer arranged below the active region. Further, the semiconductor device includes: (c) a p-type semiconductor region arranged below the active region so as to interpose the insulating layer; and (d) an n-type semiconductor region whose conductivity type is opposite to the p-type, arranged below the p-type semiconductor region. And, the p-type semiconductor region includes a connection region extending from below the insulating layer, and the p-type semiconductor region and a gate electrode of the MISFET are connected to each other by a shared plug which is an integrally-formed conductive film extending from above the gate electrode to above the connection region.
Public/Granted literature
- US20150221560A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-08-06
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