Invention Grant
- Patent Title: Semiconductor package and method for producing the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US14091545Application Date: 2013-11-27
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Publication No.: US09484278B2Publication Date: 2016-11-01
- Inventor: Thomas Bemmerl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31
Abstract:
A semiconductor package includes a housing having a bottom surface and an upper surface and a solder pad arranged in the bottom surface of the housing. The solder pad includes a solderable through hole. The housing includes an opening extending from the through hole to the upper surface of the housing.
Public/Granted literature
- US20150145109A1 Semiconductor Package and Method for Producing the Same Public/Granted day:2015-05-28
Information query
IPC分类:
