Invention Grant
- Patent Title: Semiconductor device with heat spreader
- Patent Title (中): 带散热器的半导体器件
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Application No.: US14462567Application Date: 2014-08-19
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Publication No.: US09484289B2Publication Date: 2016-11-01
- Inventor: You Ge , Meng Kong Lye , Penglin Mei
- Applicant: You Ge , Meng Kong Lye , Penglin Mei
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Priority: CN201310489288 20131018
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/495 ; H01L23/36 ; H01L23/433
Abstract:
A semiconductor device includes a package body, a semiconductor die embedded in the package body and a heat spreader attached to a top surface of the package body and spaced from semiconductor die. The heat spreader may be formed of solder that is melted within a recess in the top surface of the package body.
Public/Granted literature
- US20150108625A1 SEMICONDUCTOR DEVICE WITH HEAT SPREADER Public/Granted day:2015-04-23
Information query
IPC分类:
