Invention Grant
US09484295B2 Image forming apparatus, chip, and chip package to reduce cross-talk between signals
有权
图像形成装置，芯片和芯片封装，以减少信号间的串扰
- Patent Title: Image forming apparatus, chip, and chip package to reduce cross-talk between signals
- Patent Title (中): 图像形成装置，芯片和芯片封装，以减少信号间的串扰
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Application No.: US14513720Application Date: 2014-10-14
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Publication No.: US09484295B2Publication Date: 2016-11-01
- Inventor: Seung-hun Park , Eun-ju Hong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Staas & Halsey LLP
- Priority: KR10-2008-0111162 20081110
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/50 ; H01L27/146 ; H01L23/00 ; H01L25/16 ; H01L23/498
Abstract:
An image forming apparatus including an engine unit to perform an image forming operation, and a board unit to control the engine unit. The board unit includes at least one chip package that includes a chip. The chip includes first pads to transmit a first type of signal, a second pad to transmit a second type of signal, and a third pad interposed between the first and second pads, to reduce cross-talk between the first and second types of signals.
Public/Granted literature
- US20150041968A1 IMAGE FORMING APPARATUS, CHIP, AND CHIP PACKAGE Public/Granted day:2015-02-12
Information query
IPC分类:
