Invention Grant
- Patent Title: Structure and method to increase contact area in unmerged EPI integration for CMOS FinFETs
-
Application No.: US14874391Application Date: 2015-10-03
-
Publication No.: US09484348B2Publication Date: 2016-11-01
- Inventor: Veeraraghavan S. Basker , Kangguo Cheng , Ali Khakifirooz
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/08 ; H01L27/092 ; H01L21/8238 ; H01L21/225 ; H01L29/161 ; H01L23/528 ; H01L23/532

Abstract:
Source/drain contact structures with increased contact areas for a multiple fin-based complementary metal oxide semiconductor field effect transistor (CMOSFET) having unmerged epitaxial source/drain regions and methods for forming such source/drain contact structures are provided by forming wrap-around source/drain contact structures for both n-type FinFETs and p-type FinFETs. Each of first source/drain contact structures for the n-type FinFETs includes at least one first conductive plug encapsulating epitaxial first source/drain regions on one side of a gate structure, while each of second source/drain contact structures for the p-type FinFETs includes at least a contact metal layer portion encapsulating epitaxial second source/drain regions on one side of the gate structure, and a second conductive plug located over a top surface of the contact metal layer portion.
Public/Granted literature
- US20160099342A1 STRUCTURE AND METHOD TO INCREASE CONTACT AREA IN UNMERGED EPI INTEGRATION FOR CMOS FINFETS Public/Granted day:2016-04-07
Information query
IPC分类: