Invention Grant
- Patent Title: Method for fabricating semiconductor apparatus
- Patent Title (中): 半导体装置的制造方法
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Application No.: US14839409Application Date: 2015-08-28
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Publication No.: US09484390B2Publication Date: 2016-11-01
- Inventor: Hae Chan Park
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2014-0066071 20140530
- Main IPC: H01L21/425
- IPC: H01L21/425 ; H01L21/38 ; H01L27/24 ; H01L29/66 ; H01L45/00 ; H01L29/423 ; H01L29/08 ; H01L21/02 ; H01L21/3213 ; H01L21/04 ; H01L27/10

Abstract:
A method for fabricating a semiconductor apparatus includes forming a diffusion barrier film on a semiconductor substrate, forming a first film on a semiconductor substrate including a common source region, forming a second film on the first film, forming a conductive film on the second film, patterning the conductive film and the second film, to form an active pattern, and patterning the first film and the semiconductor substrate using the active pattern as a mask, to form a pillar; and forming a gate electrode on an outer circumference of the pillar.
Public/Granted literature
- US20150372058A1 METHOD FOR FABRICATING SEMICONDUCTOR APPARATUS Public/Granted day:2015-12-24
Information query
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