Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14810933Application Date: 2015-07-28
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Publication No.: US09484421B2Publication Date: 2016-11-01
- Inventor: Yosuke Kajiwara , Kentaro Ikeda , Hisashi Saito , Masahiko Kuraguchi
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P
- Priority: JP2014-192012 20140919
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/417 ; H01L23/528 ; H01L29/778 ; H01L27/06 ; H01L29/20 ; H01L23/535 ; H01L29/06 ; H01L29/78

Abstract:
A semiconductor device according to an embodiment includes a nitride semiconductor layer, a plurality of source electrodes provided on the nitride semiconductor layer, a plurality of drain electrodes, a plurality of gate electrodes, a first interconnection having a first distance from the nitride semiconductor layer and electrically connecting the source electrodes, a second interconnection electrically connecting the gate electrodes, and a third interconnection having a third distance from the nitride semiconductor layer and electrically connecting the drain electrodes. Each of the drain electrodes are provided between the source electrodes. Each of the gate electrodes are provided between each of the source electrodes and each of the drain electrodes. The third distance is larger than the first distance.
Public/Granted literature
- US20160087052A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-03-24
Information query
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