Invention Grant
- Patent Title: Lateral double diffused metal oxide semiconductor device and manufacturing method thereof
- Patent Title (中): 横向双扩散金属氧化物半导体器件及其制造方法
-
Application No.: US15018672Application Date: 2016-02-08
-
Publication No.: US09484437B2Publication Date: 2016-11-01
- Inventor: Tsung-Yi Huang , Ching-Yao Yang , Wen-Yi Liao , Hung-Der Su , Kuo-Cheng Chang
- Applicant: Tsung-Yi Huang , Ching-Yao Yang , Wen-Yi Liao , Hung-Der Su , Kuo-Cheng Chang
- Applicant Address: TW Zhubei, Hsinchu
- Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee Address: TW Zhubei, Hsinchu
- Agency: Tung & Associates
- Priority: TW102141562A 20131115
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/06 ; H01L21/762 ; H01L29/08 ; H01L29/10

Abstract:
The present invention discloses a lateral double diffused metal oxide semiconductor (LDMOS) device and a manufacturing method thereof. The LDMOS device includes: drift region, an isolation oxide region, a first oxide region, a second oxide region, a gate, a body region, a source, and a drain. The isolation oxide region, the first oxide region, and the second oxide region have an isolation thickness, a first thickness, and a second thickness respectively, wherein the second thickness is less than the first thickness. The present invention can reduce a conduction resistance without decreasing a breakdown voltage of the LDMOS device by the first oxidation region and the second oxidation region.
Public/Granted literature
- US20160155820A1 LATERAL DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-06-02
Information query
IPC分类: