Invention Grant
- Patent Title: Method of fabricating thin-film transistor substrate
- Patent Title (中): 制造薄膜晶体管基板的方法
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Application No.: US14952251Application Date: 2015-11-25
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Publication No.: US09484442B2Publication Date: 2016-11-01
- Inventor: Yuta Sugawara
- Applicant: JOLED INC.
- Applicant Address: JP Tokyo
- Assignee: JOLED INC.
- Current Assignee: JOLED INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-240410 20141127
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/66 ; H01L29/786 ; H01L21/02

Abstract:
A method of fabricating a TFT substrate in which a thin-film transistor is formed on a substrate, includes: forming an oxide semiconductor layer above the substrate; forming a first oxide film on the oxide semiconductor layer; performing an oxidation treatment on the oxide semiconductor layer, after the first oxide film is formed; and forming a second oxide film above the first oxide film, after the oxidation treatment is performed. In the performing of the oxidation treatment, at least one parameter of the oxidation treatment is set, based on a predetermined relationship between the at least one parameter and the threshold value of the thin-film transistor, so that the threshold value becomes a predetermined value.
Public/Granted literature
- US20160155828A1 METHOD OF FABRICATING THIN-FILM TRANSISTOR SUBSTRATE Public/Granted day:2016-06-02
Information query
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