Invention Grant
- Patent Title: Light emitting device, method of manufacturing the same, light emitting device package and lighting system
- Patent Title (中): 发光装置及其制造方法,发光装置封装及照明系统
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Application No.: US14336756Application Date: 2014-07-21
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Publication No.: US09484496B2Publication Date: 2016-11-01
- Inventor: Dae Sung Kang , Jung Min Won
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates LLP
- Priority: KR10-2010-0010204 20100204
- Main IPC: H01L33/20
- IPC: H01L33/20 ; H01L33/00 ; H01L33/06 ; H01L33/32 ; H01L33/46 ; H01L33/12 ; H01L33/22

Abstract:
A light emitting device includes an active layer formed between first and second semiconductor layers. The first semiconductor layer includes a first surface facing the active layer, a second surface opposing the first surface, and a side surface that includes a stepped portion. The stepped portion causes the side surface to extend beyond one of the first surface or second surface of the first semiconductor layer. A light emitting device may also be formed with a buffer layer that includes a stepped portion, and a light emitting device package and system may be formed from the light emitting devices.
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Information query
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