Invention Grant
US09484496B2 Light emitting device, method of manufacturing the same, light emitting device package and lighting system 有权
发光装置及其制造方法,发光装置封装及照明系统

Light emitting device, method of manufacturing the same, light emitting device package and lighting system
Abstract:
A light emitting device includes an active layer formed between first and second semiconductor layers. The first semiconductor layer includes a first surface facing the active layer, a second surface opposing the first surface, and a side surface that includes a stepped portion. The stepped portion causes the side surface to extend beyond one of the first surface or second surface of the first semiconductor layer. A light emitting device may also be formed with a buffer layer that includes a stepped portion, and a light emitting device package and system may be formed from the light emitting devices.
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