Invention Grant
US09484499B2 Transparent ohmic contacts on light emitting diodes with carrier substrates
有权
具有载体衬底的发光二极管上的透明欧姆接触
- Patent Title: Transparent ohmic contacts on light emitting diodes with carrier substrates
- Patent Title (中): 具有载体衬底的发光二极管上的透明欧姆接触
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Application No.: US11738171Application Date: 2007-04-20
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Publication No.: US09484499B2Publication Date: 2016-11-01
- Inventor: John A. Edmond , David B. Slater, Jr. , Michael J. Bergmann
- Applicant: John A. Edmond , David B. Slater, Jr. , Michael J. Bergmann
- Applicant Address: US NC Durham
- Assignee: CREE, INC.
- Current Assignee: CREE, INC.
- Current Assignee Address: US NC Durham
- Agency: Koppel, Patrick, Heybl & Philpott
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/42 ; H01L33/20 ; H01L33/22

Abstract:
A light emitting diode is disclosed that includes an active structure formed of at least p-type and n-type epitaxial layers of Group III nitride on a conductive carrier substrate. A conductive bonding system joins the active structure to the conductive carrier substrate. A first transparent ohmic contact is on the active structure adjacent the conductive carrier substrate, a second transparent ohmic contact is on the active structure opposite the conductive carrier substrate, and a third ohmic contact is on the conductive carrier substrate opposite from the active structure.
Public/Granted literature
- US20080258161A1 Transparent ohmic Contacts on Light Emitting Diodes with Carrier Substrates Public/Granted day:2008-10-23
Information query
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