Invention Grant
- Patent Title: Semiconductor light emitting module comprising an exposed plate surface
- Patent Title (中): 半导体发光模块包括暴露的板表面
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Application No.: US13723680Application Date: 2012-12-21
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Publication No.: US09484515B2Publication Date: 2016-11-01
- Inventor: Satoshi Komatsubara , Kenichi Fukuda , Shinobu Otao , Toru Furuta
- Applicant: Shimane Prefectural Government , Shimane Electronic Imafuku Works Co., Ltd.
- Applicant Address: JP Hamada-shi JP Matsue-shi
- Assignee: S.E.I Inc.,Shimane Prefectural Government
- Current Assignee: S.E.I Inc.,Shimane Prefectural Government
- Current Assignee Address: JP Hamada-shi JP Matsue-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2008-081716 20080326
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/64 ; H01L25/075 ; H01L33/60 ; H05K1/02 ; H01L33/48 ; H01L33/62 ; F21K99/00 ; F21Y101/02 ; F21Y105/00
Abstract:
Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).
Public/Granted literature
- US20130105849A1 SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-05-02
Information query
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