Invention Grant
- Patent Title: Manufacturing method of flexible device substrate
- Patent Title (中): 柔性器件衬底的制造方法
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Application No.: US14259158Application Date: 2014-04-23
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Publication No.: US09484552B2Publication Date: 2016-11-01
- Inventor: Hsin-Min Fu , Jan-Tian Lian , Chia-Sheng Hsieh , Hung-Yu Wu , Tzu-Yu Ting
- Applicant: Chunghwa Picture Tubes, Ltd.
- Applicant Address: TW Taoyuan
- Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee Address: TW Taoyuan
- Agent Winston Hsu; Scott Margo
- Priority: TW102146768A 20131217
- Main IPC: H01L27/13
- IPC: H01L27/13 ; H01L51/52 ; H01L51/00
Abstract:
A flexible device substrate includes a flexible substrate, a device layer, and a waterproof layer. The flexible substrate has a top surface and a bottom surface disposed opposite to each other. The device layer is disposed on the top surface of the flexible substrate. The waterproof layer is disposed on the bottom surface of the flexible substrate.
Public/Granted literature
- US20150171030A1 FLEXIBLE DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-06-18
Information query
IPC分类:
