Invention Grant
- Patent Title: High-frequency signal line and electronic device including the same
- Patent Title (中): 高频信号线和电子设备包括相同
-
Application No.: US14532126Application Date: 2014-11-04
-
Publication No.: US09484612B2Publication Date: 2016-11-01
- Inventor: Satoshi Sasaki , Yuki Wakabayashi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-260982 20121129
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H05K1/02 ; H05K1/14

Abstract:
A high-frequency signal line includes a dielectric body including flexible dielectric sheets laminated in a direction of lamination and also including a first line portion, a second line portion extending along the first line portion, and a third line portion connecting ends in a specified direction of the first and second line portions. In the dielectric body, a signal line extends through the first, second and third line portions, and a first ground conductor and a second ground conductor face the signal line from both sides in the direction of lamination. One or more interlayer connection conductors are pierced in the dielectric sheets to connect the first ground conductor and the second ground conductor. None of the interlayer connection conductors is provided in a portion of the third line portion that is farther in a direction opposite to the specified direction than the signal line when viewed from the direction of lamination.
Public/Granted literature
- US20150054600A1 HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2015-02-26
Information query